Api Mac-b343-gm60in Stockshipping1.item within 1-2 days after the payment is cleared.2.item ship by e-packing/fedex/ems/tnt/dhl/ups3.all the packing ship with tracking number.payment1.we accept t/t.2.other payment please send message.delivery timedhl,ups,fedex,ems express shipping usually take 3-10 working days andchina post air mail/hk post air mail shipping usually take 7-35 days dependson the country delivered to. in rare cases,the strict custom clearances will makethe delivery time a bit longer,please be patient.contact informationsale manager: veronica pei email: sales5*askplc.com ( * change to&nb...
Sncuinagsbbiznfealascd99.3±0.10.7±0.1< 0.01< 0.0001< 0.02< 0.01< 0.005< 0.02< 0.02< 0.03< 0.002the Sn99.3cu0.7 Lead Free Solder Bar Is Made Up Of 99.7% Tin And 0.7% Copper. It Is Desirable For Use In Common Metal Equipment, Copper Tubes, And Copper Plates. This Product Is A Conventional Type Of Environmentally-friendly Solder By Adoption Of Lead-free Soldering Technology.as A Typical Type Of High-temperature Lead Free Tin Bar, Our Sn99.3cu0.7 Lead Free Solder Has The Melting Point Of Approximately 227 Degrees Celsius. It Is Suitable For Both Wave Soldering And Dip Soldering Processes, Which Call For Environmental Protection. During The Soldering Process, This Product Features Nice Liquidity. It Can Substantially Reduce Various Technical Problems, Such As Bridging, Icicle, Solder Spatter, And More.featureseutectic Alloy.bridge-free And Icicle-free Soldering.smooth, Bright, Well-formed Fillets, Free Of Gross Micro-cracks, Irrespective Of The Cooling Rate.good Through-hole Penetration.good Topside Fillet Formation.dross Rate Equal Or Lower Than Tin-lead Solder.does Not Require A Nitrogen Atmosphere.does Not Erode Copper From Holes, Pads And Tracks.low Rate Of Copper Leaching Makes It Easy To Control The Copper Content Of The Solder Bath.lower Aggressiveness To Stainless Steel And Other Solder Pot Materials As Compared To Tin-silver-copper Alloys.thermal Fatigue Resistance And Creep Strength Better Than Tin-lead.slow, Even Growth Of The Intermetallic Layer At The Solder/substrate Interface.also Performs Well In Selective And Dip Soldering.applicationsdip Soldering Or Wave Soldering Of Electronic Components Such As Pcba, Thtsoldering Of Metals, Such As Copper Roofing Joineryassembly Of Stained Glass, Silver Jewelry Etcother Generally Tinning Purpose....
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